Publications
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More about my research can be found on Google Scholar profile and ResearchGate profile.
(# contributed equally )
2024
[1]. K. Wu, X. Zhu, X. Zhao, S.W. Anderson, X. Zhang, “Conformal Metamaterials with Active Tunability and Self-adaptivity for Magnetic Resonance Imaging”. [arXiv:2310.00153].
[2]. X. Zhu#, K. Wu#, S.W. Anderson, X. Zhang, “A Robust All-textile Near-field Body Area Network Based on Coaxially-shielded Metamaterial”, Nature Communications 15(1), p.6589 (2024). [DOI:10.1038/s41467-024-51061-x]
[3]. K. Wu#, X. Zhu#, S.W. Anderson, X. Zhang, “Wireless, Customizable Coaxially-shielded Coils for Magnetic Resonance Imaging”, Science Advances 10(24), p.eadn5195 (2024). [DOI: 10.1126/sciadv.adn5195].
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[4]. K. Wu, X. Zhu, T.G. Bifano, S.W. Anderson, X. Zhang. “Computational-design Enabled Wearable and Tunable Metamaterials via Freeform Auxetics for Magnetic Resonance Imaging”, Advanced Science 11, p.2400261 (2024). [DOI:10.1002/advs.202400261] [Cover Image]
[5]. X. Zhu#, K. Wu#, S.W. Anderson, X. Zhang, “Wearable Coaxially-shielded Metamaterial for Magnetic Resonance Imaging”, Advanced Materials, p.2313692 (2024). [DOI:10.1002/adma.202313692].
2023
[6]. X. Zhu#, K. Wu#, S.W. Anderson, X. Zhang, “Helmholtz Coil-Inspired Volumetric Wireless Resonator for Magnetic Resonance Imaging”, Advanced Materials Technologies 8, 2301053 (2023). [DOI:10.1002/admt.202301053].
2022
[7]. K. Wu#, G. Duan#, X. Zhao#, C. Chen, S.W. Anderson, X. Zhang. “Metamaterial-enhanced, near-field readout platform for passive microsensor tags”, Microsystems & Nanoengineering – Nature 8, 28 (2022). [DOI: 10.1038/s41378-022-00356-4].
[8]. K. Wu#, X. Zhao#, T.G. Bifano, S. W. Anderson, X. Zhang, “Auxetics-Inspired Tunable Metamaterials for Magnetic Resonance Imaging,” Advanced Materials 34, 2109032 (2022). [DOI: 10.1002/adma.202109032] [Cover Image] [YouTube]
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2020
[9]. C. Chen, Y. Huang, K. Wu, T. G. Bifano, S. W. Anderson, X. Zhao, X. Zhang, “Polarization Insensitive, Metamaterial absorber-enhanced long-wave infrared detector,” Optics Express 28, pp 28843–28857 (2020). [DOI: 10.1364/OE.403105]
[10]. X. Zhao, K. Wu, C. Chen, T. G. Bifano, S. W. Anderson, X. Zhang, “Nonreciprocal magnetic coupling using nonlinear meta-atoms,” Advanced Science 7, 2001443 (2020). [DOI: 10.1002/advs.202001443] [Cover Image]
2019
[11]. X. Zhao, G. Duan, K. Wu, S. W. Anderson, X. Zhang, “Intelligent Metamaterials Based on Nonlinearity for Magnetic Resonance Imaging,” Advanced Materials 31, 1905461 (2019). [DOI: 10.1002/adma.201905461] [Cover Image] [YouTube]
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2017
[12]. Y. Li, Y. Li, Q. Min, K. Wu, E. Liu, R. Hao, H. Chen, C. Zhuo, W. Yin, Z. Wang, H. Yu, E. Li, “Electromagnetic Characteristics of Multiport TSVs Using L-2L De-Embedding Method and Shielding TSVs,” IEEE Transactions on Electromagnetic Compatibility 59(5), 17122284 (2017). [DOI: 10.1109/TEMC.2017.2664047]
[13]. K. Wu, Z. Wang, “High-Frequency Characterization of Through-Silicon-Vias with Benzocyclobutene Liners,” IEEE Transactions on Components, Packaging and Manufacturing Technology 7(11), 17284709 (2017). [DOI: 10.1109/TCPMT.2017.2751480]
2016
[14]. C. Huang, K. Wu, Z. Wang, “Mechanical Reliability Testing of Air-Gap Through-Silicon Vias,” IEEE Transactions on Components, Packaging and Manufacturing Technology 6(5), 16002785 (2016). [DOI: 10.1109/TCPMT.2016.2544762]
[15]. C. Huang, K. Wu, Z. Wang, “Low-Capacitance Through-Silicon-Vias with Combined Air/SiO2 Liners,” IEEE Transactions on Electron Devices 63(2), 15720238 (2016). [DOI: 10.1109/TED.2015.2504093]
[16]. Q. Ma, K. Wu, Z. Wang, “Thermal Stresses of TSVs With Silicon Post Conductors and Polymer Insulators,” IEEE Transactions on Components, Packaging and Manufacturing Technology 6(12), 16581521 (2016). [DOI: 10.1109/TCPMT.2016.2620984]